As a supplier of compound semiconductor material grinding and polishing equipment manufacturing system solutions, Hemei Semiconductor (Beijing) Technology Co., Ltd. focuses on the development of high-precision grinding and chemical mechanical polishing machines, as well as the development of cutting-edge processes. As an emerging force in the industry, we have been chasing the light all the way, breaking the monopoly of foreign process technology, filling the gap in process technology, and making every effort in the wave of progress of the times!

The company's production workshop is built according to modern and intelligent standards, with a reasonable layout and efficient material flow. The workshop is equipped with equipment from international manufacturers and independently developed intelligent control systems, such as high-precision grinding machines with a flatness error of less than 2um for the grinding disc

The company's machines are widely used in the field of semiconductor material grinding and polishing, such as infrared and ultra wide bandgap. The fourth generation semiconductor material high-precision grinding and polishing process independently developed solves the pain points of traditional processes, achieves intelligent and refined control, and improves yield and processing efficiency.

The employee team is composed of professional elites who strictly follow standard procedures to ensure equipment quality. Faced with the strong demand for semiconductor materials in fields such as 5G, new energy vehicles, and aerospace.